Openings

Thank you for your interest in joining BigML!

Prospective PhD Students

Thank you for your interest in joining my research group.

I typically recruit 2–3 outstanding PhD students each year. Our research spans both theoretical and empirical machine learning, with a particular focus on data-centric and optimization-guided methods for modern foundation models. If you have a strong background in machine learning, optimization, or related areas (with publications in NeurIPS, ICML, ICLR, AISTATS, AAAI, UAI, etc) and are excited about our research (please see our lab’s recent publications, I encourage you to apply to the Computer Science PhD program at UCLA and mention my name in your application.

Due to the large number of inquiries I receive, I am generally unable to meet with prospective applicants before the application deadline. However, you are welcome to email me before or after submitting your application with the subject line “PhD Application”. Please include:

  • your CV,
  • your academic transcript(s), and
  • a brief description of your background, research experience, and research interests.

While I may not be able to respond to every email, sending this information helps ensure that I am aware of your application during the review process.

Postdoctoral Scholars
  • To enquire about postdoc positions, please send me an with your CV, a brief description of your background and research interests. Please use the subject line “Postdoctoral Fellowship Application” in your email.
UCLA Undergraduate and Master Students
  • If you are a current or admitted undergraduate or masters at UCLA and have taken machine learning courses before, please submit your info through this form, and we will contact you. If you are a double major student in Math and CS or you have a strong background in math or optimization, please also send me an email with your CV and transcript.

I may not be able to respond to all individual emails about admissions to masters or PhD programs, but I will make sure to read your email and application materials.